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SPIL is one of the major leading wafer bumping service providers in the world.
3DIC is a package technology which is gathering and vertically stacking homogeneous or heterogeneous dies into Multi-Chip-Module (MCM) with Through-Silicon-Via (TSV)...
A System in Package (SiP) is a combination of one or more semiconductor devices plus optionally passive components that define a certain functional block within a quasi-package that is then, in turn, mounted onto the system’s main board assembly...
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