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Reliability Test 乐淘棋牌
Test Item Follow standard
Moisture Sensitivity / Precondition
J-STD-020, JESD22-A113
Temperature Cycling
JESD22-A104 /MIL-STD-883 Method 1010.7
Thermal Shock
JESD22-A106 /MIL-STD-883 Method 1011.9
Pressure Cooker / Autoclave
High Temperature Storage Life
JESD22-A103 /MIL-STD-883 Method 1008
High Temperature Static Bias
Temperature and Humidity Biased / Unbiased
JESD22-A101 /EIAJ-IC-121
HAST Biased / Unbiased
JESD22-A110, A118
Solderability Test
JESD22-B102 /MIL-STD-883 Method 2003.7
Lead Fatigue Test
JESD22-B105 /MIL-STD-883 Method 2004
Mark Permanency
JESD22-B107 /MIL-STD-883 Method 2015.11
Low Temperature Storage
Bubble Leakage Test
JESD22-A109 /MIL-STD-883 Method 1014.9
Board Level Bending Test
Board Level Drop/Shock Tests
JESD22-B111/ JESD22-B110
Solder Joint Test
Bump Electromigration Test
Whisker Test
Equipment Capability
SAM (Scanning Acoustic Microscopes)
High resolution, non-destructive detection of delamination, void, crack
Chemical Auto-Decapsulator
Encapsulation removal by Chemical etching ( Au & Cu & Ag wire)
SEM (Scanning Electron Microscopes)
Up to x100,000 Magnification Inspection
FE-SEM (Field Emission SEM)
Up to x650,000 Magnification Inspection; 2.2nm at 1kv, 1nm at 15kv
EDX (Energy Dispersive X-ray)
Surface Composition Analysis / depth>1um
Grinder / Polisher
Package Cross-sectioning or Delayering
Precision Saw
Precision Micro Cutters
Curve tracer
Electrical Characteristic Curve Analysis
Real time Microfocus X-ray
Optical Microscopes
Up to 1000X Magnification Optical Inspection
IR microscope
Examine defect of silicon chipping
Probing Station
Up to 1000X Movement Accuracy Chip Micro-Prober
TDR (Time Domain Reflectometry)
Site Isolation of Electrical open/short Failure
FIB (Focus Ion Beam system)
Micro area x-section
Laser decapsulater
Encapsulation removal by Laser
ESCA / XPS (X-ray Photoelectron Spectroscopy)
Surface chemical state analysis (1-10 nm) Qualitative and quantitative analysis
FTIR (Fourier Transform Infrared Spectroscopy)
Polymer functional group
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